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Stress and Electromigration

Published online by Cambridge University Press:  15 February 2011

J.R. Lloyd
J.R. Lloyd*
Affiliation:
Digital Equipment Corporation 77 Reed Road, Hudson MA 01749-2895
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Extract

The interdependence of mechanical stress and electromigration behavior has been recognized for quite some time, but has only begun to be fully appreciated and dealt with in a meaningful manner. There have been a number of recent advances in understanding that also may lead to a change in the way that electromigration failure is viewed in real applications.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 231
Copyright
Copyright © Materials Research Society 1995

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References

1 Ainslee, N.G., d’Heurle, F.M. and Wells, O.C., Appl. Phys. Lett., 30, 173 (1972)Google Scholar
2 Spitzer, S.M. and Schwartz, S., IEEE Trans. Electron. Devices, ED-16, 348 (1969)Google Scholar
3 Blair, J.C., Ghate, P.B. and Haywood, C.T., Appl. Phys. Lett., 17, 281 (1970)Google Scholar
4 Learn, A.J., J. Appl. Phys., 44, 1251 (1973)Google Scholar
5 Satake, T., Yokoyama, K.,Shirakawa, S. and Sawaguchi, K., Jap. J. Appl. Phys., 12, 518 (1973)Google Scholar
6 Blech, I.A. and Kinsbron, E., Thin Solid Films, 25, 327 (1975)Google Scholar
7 Blech, I.A., J. Appl. Phys., 47, 1203 (1976)Google Scholar
8 Blech, I.A. and Herring, C., Appl. Phys. Lett., 29, 131 (1976)Google Scholar
9 Blech, I.A. and Tai, K.L., Appl. Phys. Lett., 30, 387 (1977)Google Scholar
10a Kinsbron, E., Blech, I.A. and Komem, Y., Thin Solid Films, 46, 179 (1977)Google Scholar
10b Blech, I.A. and Levi, A.A., Trans. ASME, 48, 442 (1981)Google Scholar
10c Jones, R.E., Proc. 25th Ann. Int’l Reliab. Phys. Symp., 9, (1987)Google Scholar
10d Li, J.C.M., Oriani, R.A. and Darken, L.S., Physik, Z.. Chem. Neue Folge, 49, 271 (1966)Google Scholar
10e Hemmert, R.S., Prokop, G.S., Lloyd, J.R., Smith, P.M. and Calabrese, G.M., J. Appl. Phys., 53, 4456 (1982)Google Scholar
11 Lloyd, J.R., Smith, P.M. andProkop, G.S., Thin Solid Films, 93, 385 (1982)Google Scholar
12 Shingubura, S., Iwabuchi, S., and Shima, S., Extended Abstracts of the 19th Conf. on Silid State Devices and Materials, 455, (1987)Google Scholar
13 Wada, T., Sugimoto, M. and Ajiki, T., Solid State Electronics, 30, 493 (1987)Google Scholar
14 Ross, C.A., Ph.D. Thesis, Cambridge Univeristy, November 1988 Google Scholar
15 Ross, C.A., Drewery, J.S.,Somekh, R.E. and Evetts, J.E., J. Appl. Phys., 66, 2349 (1989)Google Scholar
16 Koleshko, V.M. and Kiryushin, I.V., Phys. Stat. Sol. (a) 117, 177 (1990)Google Scholar
17 Kahn, H. and Thompson, C.V., Appl. Phys. Lett., 59, 1308 (1991)Google Scholar
18 Baldini, G.L., and Scorzoni, A., IEEE Trans. Electron. Dev., 38, 469 (1991)Google Scholar
19 Kircheim, R., Acta Met. Mater., 40, 309 (1992)Google Scholar
20 Hemmert, R.S. and Shatzkes, M., J. Appl. Phys., 73, 813 (1993)Google Scholar
21 Korhonen, M.A., Borgesen, P., Tu, K.N. and C-Yu, Li, J. Appl. Phys., 73, 3790 (1993)Google Scholar
22 Clarke, D.R., Ma, Q., Chiras, S., Thouless, M. and Suo, Z., MRS Extended Abstract# C11.14, Spring meeting 1993 Google Scholar
23 Shatzkes, M. and Lloyd, J.R., J. Appl. Phys., 59, 3890 (1986)Google Scholar
24 In Hirth, J.P. and Lothe, J., Thoery of Dislocations, McGraw-Hill Book Company, New York p.53 (1968)Google Scholar
25 Grain Boundary Structure and Kinetics, American Society for Metals, Metalsa Park Ohio, (1980)..there are several papers and many micrographs in this volume that support this viewGoogle Scholar
26 Lloyd, J.R. and Kitchin, J., J. Mater Res., 9, 563 (1994).Google Scholar
27 Dwyer, V.M., Wang, F.-S. and Donaldson, P., J. Appl. Phys., 76, 7305 (1994)Google Scholar
28 Kircheim, R. and Kaeber, U., J. Appl. Phys., 70, 172 (1991)Google Scholar
29 Lloyd, J.R. and Kitchin, J., UnpublishedGoogle Scholar
30 Clement, J.J. and Thompson, C.V., accepted for publication in J. Appl. Phys. (1995)Google Scholar
31 Atakov, E.M., Clement, J.J., and Miner, B., MRS Proc. Vol. 309, 133 (1993)Google Scholar
33 Lloyd, J.R., MRS Proc. Vol. 338, 367 (1994)Google Scholar
32 Miner, B., Atakov, E.A., Shepela, A. and Bill, S., MRS Symp. Proc. Vol. 338, 333 (1994)Google Scholar
34 Ruoff, A.L., Materials Science, Prentice-Hall, Inc. Englewood Cliffs, NJ (1973)Google Scholar
35 Oates, A.S. and Lloyd, J.R., MRS Symp. Proc. Vol. 338, 269 (1994)Google Scholar
36 Kisselgof, L., Baranowski, S.P., Broomfield, M.C., Spooner, T., Elliott, L.. Brooke, L. and Lloyd, J.R., SPIE Vol. 1805, 154 (1992)Google Scholar
37 Marcus, M.A.,Wood, W.F., Cirelli, R.A.,Kistler, R.C., Ciampa, N.A., Mansfield, W.M., Barr, D.L., Volkert, C.A. and Steiner, K.G., MRS Proc. Vol. 338, 203 (1994) 241Google Scholar
38 Besser, P.R., Marieb, T.N., Bravman, J.C. and Flinn, P.A., MRS Proc. Vol. 338, 275 (1994)Google Scholar
39 Lloyd, J.R. and Arzt, E., MRS Proc. Vol. 265, 45 (1992)Google Scholar
40 Sauber, J. and Lloyd, J.R. (Unpublished Work)Google Scholar
41 Lloyd, J.R., MRS Proc. Vol. 239, 667 (1992)Google Scholar
42 Li, C.-Y., Borgesen, P. and Sullivan, T.D., Appl. Phys. Lett., 59, 1464 (1991)Google Scholar
43 Clement, J.J., Lloyd, J.R. and Thompson, C.V., this conferenceGoogle Scholar
44 Elliott, L.J., Spooner, T., Rose, J.H. and Shuman, R., this conferenceGoogle Scholar
45 Arzt, E., Kraft, O. and Moeckl, U.E., MRS Proc. Vol. 338, 397 (1994)Google Scholar
46 Marieb, T., Bravman, J.C., Flinn, P. and Madden, M., MRS Proc. Vol. 338, 409 (1994)Google Scholar
47 Sanches, J.E. Jr. and Pham, V., MRS Proc. Vol. 338, 459 (1994)Google Scholar