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Published online by Cambridge University Press: 25 February 2011
A line-source electron beam has been used to melt and recrystallize isolated Si layers to form Si-on-Insulator structures, and the processis simulated by heat flow calculations. Using sample sweep speeds of 100-600 cm/s and peak power densities up to 75 kW/cm2 in the 1 × 20 mm beam, we have obtained single-crystal areas as large as 50 × 350 μIm. Seed openings to the substrate are used to control the orientation of the regrowth and the heat flow in the recrystallizing film. A finite-element heat flow code has been developed which correctly simulates the experimental results and which allows the calculation of untried sample configurations.