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Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints

Published online by Cambridge University Press:  25 February 2011

Sheera Knecht
Sheera Knecht*
Affiliation:
Digital Equipment Corporation, Andover, MA 01810
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Abstract

The matrix creep failure indicator developed by Shine and Fox is extended to cases when strain is multiaxial and varies with position in the structure. Analysis of a thermal fatigue test of leaded surface mount devices found in the literature illustrates application of the method. A butt joint surface mount configuration is then tested in simple mechanical loading and also analyzed using the finite element method. It is found that the matrix creep “damage integral” method gives good correlation with observed solder fatigue failures for both cases.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 411
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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