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Electrochemical Deposition of (Bi,Sb)2Te3 for Thermoelectric Microdevices

Published online by Cambridge University Press:  01 February 2011

Jean-Pierre Fleurial ,
Jennifer A. Herman ,
G. Jeffrey Snyder ,
Margaret A. Ryan ,
Alexander Borshchevsky  and
Chen-Kuo Huang
Jean-Pierre Fleurial
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
Jennifer A. Herman
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
G. Jeffrey Snyder
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
Margaret A. Ryan
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
Alexander Borshchevsky
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
Chen-Kuo Huang
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive Pasadena, CA 91109, USA
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Abstract

New experimental methods have been developed to electrochemically deposit p-type Sb-rich Bi2-xSbxTe3, Pb-doped and Bi-doped Bi2Te3, and PbTe thick films. Some of the deposited films were dense and had a smooth surface morphology. These films were deposited potentiostatically at room temperature in an acidic aqueous electrolyte. Experimental deposition of Bi2Te3 alloys into various thick nanoporous templates made out of anodized alumina has also been achieved. Miniaturized thermoelements for microdevices (25 μm tall, 60 μm diameter) were grown by plating through thick photoresist templates. The experimental techniques developed, as well as the transport properties of some of the films and filled templates, will be presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 626: Symposium Z – Thermoelectric Materials 2000 - The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications , 2000 , Z11.3
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Pandey, R.K., Sahu, S.N. and Chandra, S. in Handbook of Semiconductor Deposition, Ed. Dekker, M., New York (1996).Google Scholar
2. Muraki, M. and Rowe, D.M., Proc. X Int. Conf. on Thermoelectrics, Cardiff, Wales, UK, 174 (1991).Google Scholar
3. Fleurial, J.-P. et al., in: Thermoelectric Materials 1998 eds. Tritt, T.M., Kanatzidis, M.G., Lyon, H.B., and Mahan, G.D., MRS Volume 545, MRS 1998 Fall Meeting Symp. Proc., (1998).Google Scholar
4. Fleurial, J.-P. et al., Proceedings, 18th International Conference on Thermoelectrics, ed. Ehrlich, A.C. (IEEE Catalog 99TH8407), p. 294 (1999)Google Scholar
5. Fowlkes, W.Y., Creveling, C.M., in Engineering Methods for Robust Design Using Taguchi Methods in Technology and Product Development, Addision-Wesley Publishing Company (1995).Google Scholar
6. Zhitinskaya, M.K. et al., Proc. XIV Intl. Conf. Thermoelectrics, St. Petersburg, Russia, June 27-30, 231 (1995).Google Scholar
7. Anisev, B.B. et al., Inorg. Materials, 8, 1380 (1991).Google Scholar
8. Williams, R., private communication.Google Scholar
9. Streltsov, E.A. et al., Electrochimica Acta, 407–413 (1998).Google Scholar
10. Oosawa, Y. et al., Proceedings, 18th International Conference on Thermoelectrics, ed. Ehrlich, A.C. (IEEE Catalog 99TH8407), p. 550 (1999).Google Scholar
11. Sun, X., Zhang, Z. and Dresselhaus, M.S., Appl. Phys. Lett., 74, 4005 (1999).Google Scholar
12. Cronin, S.B. et al., Proceedings, 18th International Conference on Thermoelectrics, ed. Ehrlich, A.C. (IEEE Catalog 99TH8407), p. 554 (1999).Google Scholar
13. Fleurial, J.-P., Borshchevsky, A., Caillat, T. and Ewell, R., Proc. 32nd IECEC, July 27-August 1, Honolulu, Hawaii (2), 1080 (1997).Google Scholar