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Development of Polyimide-based Flexible Tactile Sensing Skin

Published online by Cambridge University Press:  11 February 2011

Jonathan Engel ,
Jack Chen ,
Chang Liu ,
Bruce R. Flachsbart ,
John C. Selby  and
Mark A. Shannon
Jonathan Engel
Affiliation:
Micro and Nanotechnology Laboratory
Jack Chen
Affiliation:
Micro and Nanotechnology Laboratory
Chang Liu
Affiliation:
Micro and Nanotechnology Laboratory
Bruce R. Flachsbart
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
John C. Selby
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
Mark A. Shannon
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
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Abstract

We present a novel microfabrication process for realizing a new type of flexible sensory “smart skin”. In this work, we focus on demonstration of a skin containing a two dimensional array of tactile sensors using polyimide and metal strain gauges. A novel polymer microfabrication approach coupled with surface release methods is demonstrated. The process yields flexible sensory skins in a low cost, efficient manner. Experimental characterization of the devices is also presented. The demonstrated sensors use metal-film strain gauges in a multiplexed two-dimensional array of tactile pixels (taxels) embedded in a polyimide thin film membrane to detect force distribution on the flexible skin. The arrays have been used to image force distributions and could be used with slip-detection friction measurement for robotic gripping application.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 736: Symposium D – Electronics on Unconventional Substrates–Electrotextiles and Giant-Area Flexible Circuits , 2002 , D4.5
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

Lee, M.H. and Nicholls, H.R., “Tactile sensing for mechatronics - a state of the art survey” Mechatronics 9 1–33 (1999).Google Scholar
Kane, B.J., Cutkosky, M.R., Kovacs, T. A., “A traction stress sensor array for use in high-resolution robotic tactile imaging” JMEMS 9 425–434 (2000).Google Scholar
[3] Beebe, DJ., Hsieh, A.S., Denton, D.D. and Radwin, R.G., “A silicon force sensor for robotics and medicine” Sensors and Actuators A 50 55–56 (1995).Google Scholar
[4] Gray, B.L. and Fearing, R.S., “A surface micromachined microtactile sensor array” Proc 1996 IEEE Int 'l Conf. On Robotics and Automation (Minneapolis, MN) 1–6 (1996).Google Scholar
[5] Leineweber, M., Pelz, G., Schmidt, M., Kappert, H., Zimmer, G., “New tactile sensor chip with silicone rubber cover” Sensors and Actuators A 84 236–245(2000).Google Scholar
[6] Kolesar, E.S. and Dyson, C.S., “Object imaging with a piezoelectric robotic tactile sensor” JMEMS 4 87–96 (1995).Google Scholar
[7] Reston, R.R. and Kolesar, E.S., “Robotic tactile sensor array fabricated from a piezoelectric polyvinylidene fluoride film” Proc. 1990 IEEENAECON 3 1139–114(1990).Google Scholar
[8] Jiang, F., Tai, Y-C., Walsh, K., Tsao, T., Lee, G-B., Ho, C-M., “A flexible MEMS technology and its first application to shear stress sensor skin” Proc 1997 IEEE Int'l Conf. On MEMS 465–470 (1997).Google Scholar
[9] Beebe, D.J. and Denton, D.D., “A flexible polyimide-based package for silicon sensors” Sensors and Actuators A 44 57–64 (1994).Google Scholar
[10] Cao, L., Kim, T.S., Zhou, J., Mantell, S.C., Polla, D.L., “Calibration technique for MEMS membrane type strain sensors” Proc. 1999 IEEE Symposium on Microelectronics 204–210 (1999).Google Scholar
[11] Shimizu, T., Shikida, M., Sato, K., Itoigawa, K., “A new type of tactile sensor detecting contact force and hardness of an object” 2002 Proc 2002 IEEE Conf. On MEMS 1 344–347 (2002).Google Scholar
[12] Nakamura, Y., Suzuki, Y., Watanabe, Y., “Effect of oxygen plasma etching on adhesion between polyimide films and metal” Thin Solid Films 290–291 367–369 (1996).Google Scholar
[13] Caterer, M.D., Daubenspeck, T.H., Ference, T.G., Holmes, S.J., Quinn, R.M., “Processing thick multilevel polyimide films for 3-D stacked memory” IEEE Transactions on Advanced Packaging 22 189–199 (1999).Google Scholar