Hostname: page-component-55f67697df-gmt7q Total loading time: 0 Render date: 2025-05-10T12:12:28.107Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion of Thin Metal Films to Vacuum-Cleaved SiO2, Al2O3, and MgO Substrates

Published online by Cambridge University Press:  22 February 2011

Andris Simanovskis ,
Sara Stolyarova  and
Silvia Varchenya
Andris Simanovskis
Affiliation:
Institute of Physics, Latvian Academy of Sciences, 229021, Riga, Salaspils, Latvia
Sara Stolyarova
Affiliation:
Institute of Physics, Latvian Academy of Sciences, 229021, Riga, Salaspils, Latvia
Silvia Varchenya
Affiliation:
Institute of Physics, Latvian Academy of Sciences, 229021, Riga, Salaspils, Latvia
Get access

Abstract

The adhesion of Au, Ag, Pb, Sn, In, Cu, Cd, Mg, Ca films to vacuum-cleaved Al2O3, MgO and SiO2 single crystals has been studied. It is shownf -4hat for botn Al2O3 and MgO the level of adhesion is slightly higher than that for SiO2 and tends to increase with chemical activity of deposited metals. As a result, the adhesion varies from the level of van der Waals forces to the level of chemical interaction.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 599
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Benjamin, P. and Weaver, C., Proc. Roy. Soc. 254 A, 163 (1960).Google Scholar
2. Lm, D.S., J. Phys. D: Appl. Phys. 4, 1977 (1971).Google Scholar
3. Jacobsson, R. and Kruse, B., Thin Solid Films 15, 71 (1973).CrossRefGoogle Scholar
4. Hieber, H., Thin Solid Films 37, 335 (1976).CrossRefGoogle Scholar
5. Poley, N.M. and Whitaker, H.L., J. Vac. Sci. Technol. 11, 114 (1974).Google Scholar
6. Bray, R.C., Quate, C.F., Calhoun, J., Eoch, R., Thin Solid Films, 74, 295 (1980).CrossRefGoogle Scholar
7. Varchenya, S.A. and Upit, G.P., Thin Solid Films 122, 59 (1984).CrossRefGoogle Scholar
8. Varchenya, S.A., Simanovskis, A., Stolyarova, S.V., Thin Solid Films 164, 147 (1988).CrossRefGoogle Scholar
9. Pabst, R.F. and Elssner, G., J. Mat. Sci. 15, 188 (1980).CrossRefGoogle Scholar
10. Kovalenko, V.V. and Upit, G.P., Fizika i Khimija Obrabotki Materialov 6, 77 (1983)(in Russian).Google Scholar
11. Kovalenko, I.V.V. and Upit, G.P., Fizika i Khimija Obrabotki Materialov 2, 74 (1984) (in Russian).Google Scholar
12. Oh, Tae Sung, Gannon, R.M., Ritchie, R.O., J. Am. Ceram. Soc. 70, C–352 (1987).Google Scholar
13. Colligon, J.S. and Kheyrandish, H., Vacuum, 39, 705 (1989).Google Scholar
14. Kikuchi, A., Baba, S., Kinbara, A., Thin Solid Films 164, 153(1988).Google Scholar
15. Kinbara, A., Baba, S., Kikuchi, A., Kajiwara, T., Watanabe, K., Thin Solid Films 171, 93 (1989).Google Scholar
16. Kovalenko, V.V. and Upit, G.P., Poverkhnost' 2, 46 (1985) (in Russian).Google Scholar
17. Phillips, J.S., Rev. Modern Phys. 42, 317 (1970).CrossRefGoogle Scholar
18. Kovalenko, V.V. and Varchenya, S.A., Fizika i Khimija Obrabotki Materialov 1, 63 (1988) (in Russian).Google Scholar