Published online by Cambridge University Press: 22 February 2011
The fracture behavior of CVD diamond is examined by indentation experiments in which slow crack growth has been observed. Diamond films of 400μm thickness were prepared by plasma-enhanced CVD on a silicon substrate, subsequently removed from the substrate, and polished for indentation testing. A microhardness tester was used to produce Vickers indentations under low load. Crack length measurements over time revealed susceptibility to slow crack growth in ambient testing conditions. The stress-corrosion susceptibility coefficient, N, was measured as 9.3.